Taiwanese semiconductor foundry TSMC revealed on September 29 that the company plans to commence chip production utilizing 28nm process technology in the first quarter of 2010, Commercial Times of Taiwan reported. TSMC said that its 28nm process will be a full-node technology, and the company will offer two types of materials, HKMG (High-K Metal Gate) and SiON (Silicon Oxynitride), on demand of its customers. Compared with TSMC's present 40nm process technology, the 28nm process is projected to achieve double raw gate density, 30% to 50% more speed, and 30% to 50% less power consumption.